How to use Hot Air Solder Tool

Hot Air Solder useful to remove, install, molding and re-solder the components, both SMD (centipedes), BGA, and other small components. Re-heat the soldering process or the IC is to fix the legs ic which may be less attached to the PCB and not to repair the damaged IC.
Temperature and air pressure in the steam soldering should be taken not to damage the PCB, solder in the use of steam required precision, patience and precision accuracy. How to hold the solder fumes must be strong and perpendicular to the target component soldering.

Hot Air Blower.
Blower is one variant of Solder. Called Hot Air blower for the use of air usage. In standard blower used in practice, there are two settings. The first setting is the power of heat (heating) to be issued through the eyes of solder, and other settings is pressure (force gusts) air will be emitted. Both of these works in a linear regulator with each other. The higher the temperature of the air being emitted, will grow strong again if the air pressure is raised to be issued.
Hot Air Blower Practice
Use of this blower is quite simple. In the soldering process application components, hold the blower exactly the same way by holding regular solder. The main advantage of this blower is melt lead with air expelled, not with iron rods used in ordinary solder.

As for how to use this blower is:
Turn ON the blower switch function. After Blower switch on, we can adjust the settings contained in the blower.

The first setting is Heating (heat / temperature), while the second is the air pressure regulation to be issued.
Turn the heat setting to the desired temperature, such as 200 degrees C. The temperature of 200 degrees C will be generated, but it will not be felt on the soldering tip if air pressure is released is positioned 0.

For Digital Blower, Set the temperature by pressing the UP and DOWN buttons. The air pressure is set by twisting. Set the air pressure as desired, such as in positions 1, 2, 3 or others. The air will be blown 200 degrees C and can be felt the heat released. In the above circumstances, the blower can be used for the desired purposes. The use of a blower is dependent upon the type of device to be soldered, because it will be highly correlated with the settings of the heat and pressure of the air blower.
Hot Air Blower Controlling
  1. Remove fluid (drying) 100-200 degrees, the air pressure 8 (toned)
  2. Heats / melt lead from a position above 350-400 degrees, the air pressure of 3 (choose which slowest)
  3. Heats / melt tin from the down position 350-400 degrees, the air pressure 3 (select which slowest)
  4. Lifting and installing the components 350-400 degrees, the air pressure of 3 (choose which slowest)
  5. Lifting Flexible PCB 250-300 degrees, the air pressure of 3 (choose which slowest)
  6. Lifting plastic components 250-275 degrees, the air pressure 3 (select which slowest)
  7. IC foot print 350-400 degrees, the air pressure 3 (select which slowest)

How To Opening SMD IC With Hot Air Blower
SMD IC's legs are not included in the PCB holes, but attached directly on the PCB board. As in the previous guidance, we can use a blower fatherly open the IC that can not be opened with ordinary solder. Some IC is widely available on computers, mobile phones, and other technological devices. Setting the blower according to the needs of the components that will be opened.
Prepare a tweezers to hold / draw components that we will open. Use anti hot liquid (FLUX who Condensed) on the circuit or component to be on the blower, such as the surface of the IC to be opened.

Use a blower to melt lead-tin attached to the foot of the IC and the circuit board. Navigate eyes blower to the legs. Spray air blower hinga completely melted tin, do not pull too strong components with tweezers, because it will cause damage to the lead track on the circuit board.
Once completely melted tin, the IC body rocking with tweezers, then lift it with tweezers / Vacuum Pen. IC opening process has also been completed.

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